Book

Wire bonding in microelectronics: materials, processes, reliability, and yield

by  George G Harman / George G Harman

Table Of Contents

  • Technical introduction to the second edition
  • Ultrasonic bonding systems and technologies (Including ultrasonic wire bonding mechanism)
  • Some aspects of bonding wire characteristics and metallurgy that can affect bonding, reliability, or testing
  • Wire bond testing
  • Gold-aluminum intermetallic compounds and other metallic interface reactions encountered in wire bonding
  • Bond failures resulting from gold-plating impurities and conditions
  • Cleaning to improve bondability and reliability
  • Mechanical problems in wire bonding
  • High-Yield and fine-pitch wire bonding
  • Wire bonding to multichip modules and other soft substrates

Subject

Production control / Reliabiligy / Defects / Failures / Wire bonding (Electronic packaging) / Electronic packaging / Semiconductors

Details

Part of Series Electronic packaging and interconnection series
Published New York : McGraw-Hill, 1997
Language English
Material xiv, 290 p.
ISBN 0070326193
Location
TK 7836 H2873 1997 C.1
TCDC Bangkok - General Collection
TK 7836 H2873 1997 C.2
TCDC Bangkok - Closed Stack2

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