Book

Chip scale package (CSP): design, materials, processes, reliability, and applications

by  John H Lau / Shi-Wei Ricky Lee

Table Of Contents

  • Solder-bumped flip chip and wire-bonding chip on CSP substrate
  • Fujitsu's small outline no-lead/c-lead package (SON/SOC)
  • Fujitsu's bump chip carrier (BCC)
  • Fujitsu's MicroBGA and Quad Flat Nonleaded package (QFN)
  • Hitachi cable's lead-on-chip chip scale package (LOC-CSP)
  • Hitachi cable's micro stud array package (MSA)
  • LG semicon's bottom-leaded plastic package (BLP)
  • TI Japan's memory chip scale package with LOC (MCSP)
  • 3M's enhanced flex CSP
  • General electric's chip-on-flex chip scale package (COF-CSP)
  • Hitachi's chip scale package for memory devices
  • IZM's flexPAC
  • NEC's fine-pitch ball grid array (FPBGA)
  • Nitto Denko's molded chip size package (MCSP)
  • Sharp's chip scale package
  • Tessera's micro-ball grid array (uBGA)
  • TI Japan's micro-star BGA (uStar BGA)
  • TI Japan's memory chip scale package with flexible substrate (MCSP)
  • Amkor/Anam's ChipArray package
  • EPS's low-cost solder-bumped flip chip NuCSP
  • IBM's ceramic mini-ball grid array package (Mini-BGA)
  • IBM's flip chip-plastic ball grid array package (FC/PBGA)
  • Matsushita's MN-PAC
  • Motorola's SLICC and JACS-Pak
  • National semiconductor's plastic chip carrier (PCC)
  • NEC's three-dimensional memory module (3DM) and CSP
  • Sony's transformed grid array package (TGA)
  • Toshiba's ceramic/plastic fine-pitch BGA package (C/P-FBGA)
  • ChipScale's micro SMT package (MSMT)
  • EPIC's chip scale package
  • Flip chip technologies' UltraCSP
  • Fujitsu's super CSP (SCSP)
  • Mitsubishi's chip scale package (CSP)
  • National semiconductor's uSMD
  • Sandia national laboratories' mini ball grid array package (mBGA)
  • ShellCase's shell-PACK/Shell-BGA

Subject

Design and construction / Integrated circuits / Microelectronic packaging

Details

Part of Series Electronic packaging and interconnection series
Published New York : McGraw-Hill, 1999
Language English
Material xxii, 564 p.
ISBN 0070383049
Location
TK 7874 L3662 1999 C.1
TCDC Bangkok - General Collection
TK 7874 L3662 1999 C.2
TCDC Bangkok - Closed Stack2

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