Book
Area array packaging materials: adhesives, pastes, and lead-free
Table Of Contents
- Polymer packaging materials: adhesives, encapsulants, and underfills
- Hermetic packaging systems: adhesive and getter
- Ares array solder spheres, pastes, and fluxes
- Modern solder and solder paste
- Lead-free systems and process implications
- Electrically conductive adhesives for surface-mount and flip chip processes: an alternative to solder?
Subject
Ball grid array technology / Microelectronic packaging
Details
Published
New York : McGraw-Hill, 2004
Language
English
Material
166 p.
ISBN
0071428283
Location
TCDC Bangkok - General Collection
miniTCDC - URU
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