Book
Area array packaging handbook: manufacturing and assembly
Table Of Contents
- Packaging con cepts and design : Introduction to electronic packaging
- Electronics industry overview
- Tren/drivers in the electronics manufacturing industry
- Area array packaging
- Stacked/3D packages
- Compliant IC packaging
- Flip chip technology
- Option in high-denaity part cleaning
- MEMS packaging and assembly challenges
- Ceramic ball and column grid array overview
- Materials
- Polymer packaging materials:adhesives, encapsulants, and underfills
- Hermetic packaging systems:adhesives and getter
- Area array solder spheres, pastes, and fiuxes
- Modern solder and solder paste
- Lead-free systems and process implications
- Electrically conductive adhesives for surface-mount and flip chip processes:analternative to solder
- Equipment and processes : Next0generation flip chip materials and processes
- Flip chip assambly and inderfilling
- BGA and CSP rework:what is involved
- BGA assmbly reliablity
- Die attach and rework
- Liquid encapsulation equipment and processes
- Molding for area array packages
- Screen printing and stenciling
- Criteria for placement and processing of advanced packages
- Ovens in electronics
- Process development, control, and organization
- Economics and produstivity : Metrics:the key to produstivity
- Cost estimating for electronic assmbly
- Feture : The future of electronic packaging
- The future of SMT process equipment
Subject
Ball grid array technology / Microelectronic packaging
Details
Part of Series
McGraw-Hill packaging and electronics books
Published
New York : McGraw-Hill, 2002
Language
English
Material
1 v. (various pagings)
ISBN
0071374930
Location
TCDC Bangkok – Closed Stack (Reference Collection)
TCDC Bangkok - Reference Collection (Handbooks)
TCDC Chiang Mai - Reference Collection
TCDC Khon Kaen - Reference Collection
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