Book

Area array package design: techniques in high-density electronics

by  Ken Gilleo

Table Of Contents

  • Introduction to electronic packaging
  • Trends/drivers in the electronics manufacturing industry
  • Area array packaging
  • Stacked/3D packages
  • Compliant IC packaging
  • Flip chip technology
  • Options in high-density part cleaning
  • MEMS packaging and assembly challenges
  • Ceramic ball and column grid array overview

Subject

Design / Electronic packaging

Details

Part of Series McGraw-Hill engineering reference guide series
Published New York : McGraw-Hill, 2004
Language English
Material xii, 204 p.
ISBN 0071428275
Location
TK 7870.15 A678 2004 C.2
TCDC Bangkok - General Collection
TK 7870.15 A678 2004 C.1
TCDC Bangkok - Closed Stack2

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